Published September 1998 by Materials Research Society .
Written in EnglishRead online
|Contributions||Wei Zhu (Editor), Lawrence S. Pan (Editor), Thomas E. Felter (Editor), Christopher Holland (Editor)|
|The Physical Object|
|Number of Pages||207|
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Vacuum Microelectronics is intended for practitioners in the display, microwave, telecommunications, and microelectronics industries and in government and university research laboratories, as well as for graduate students majoring in electrical engineering, materials science, and physics.
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attainable parameters of the field emission process, and its application to problems of vacuum microelectronics. The book is intended for researches in various branches of physics, postgraduate and undergraduate students, specialists in physical electronics (emission electronics, micro.
Certain materials and process issues must be dealt with in approaching the 1-Gb DRAM technology and are summarized in Table ' As shown in Table 5, operating voltages of devices may be reduced from to V, thus allowing lower-power products to be developed, which are needed to produce the portable computing applic- ations listed in.
Microelectronic Circuits, Fourth Edition is an extensive revision of the classic text by Adel S. Sedra and K. Smith. The primary objective of this text remains the development of the student''s ability to analyze and design electronic circuits, both analog and digital, discrete andintegrated.
Fundamental developments in modern technology, particularly the increased emphasis on integrated /5(7). • Problems with simple Spindt emitters Contamination Focusing Uniformity of array fabrication Power consumption.
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- Mechanical curiosity based on new microelectronics fabrication techniques Bulk-etched silicon wafers used as pressure sensors in ’s Kurt Petersen published -Silicon as a Structural Material in - Reference for material properties and etching data for silicon Early experiments in surface-micromachined polysilicon in ’s.
Materials issues in vacuum microelectronics: symposium held April, San Francisco, California, U.S.A. materials issues in vacuum microelectronics volume mrs proceedings Posted By Norman Bridwell Media TEXT ID cea9a Online PDF Ebook Epub Library examining new applications for semiconductors magnetic alloys dielectrics nanoscale materials and photonic materials in addition to original research papers review papers.
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The book focuses on ﬁeld emission from cold cathodes, which is currently the most common and also most promising source of electrons for vacuum microelectronics.
The book strives to connect the fundamental and practical aspects of the ﬁeld so that a broad base of readers can ﬁnd the book useful. To this end, the book goes from the. These issues arising from porous low-k materials are the subject of the present chapter.
To provide high speed, low dynamic power dissipation, and low cross-talk noise for microelectronic circuits, low-dielectric-constant (low-k) materials are required as the inter- and intra-level dielectric (ILD) insulator of the back-end-of-line interconnects.
Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena > Volume 3, Issue 3 > / This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source.
Adhesion of different dielectric materials; Delamination and reliability issues in packaged devices Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced.
Nineteen experts from the electronics industry, research institutes and universities have joined forces to prepare this book. Vacuum Electronics covers the electrophysical fundamentals, the present state of the art and applications, as well as the future prospects of microwave tubes and systems, optoelectronics vacuum devices, electron and ion beam devices, light and X-ray emitters,particle.
Mechanical Behavior of Materials and Structures in Microelectronics. $ (C) Part of MRS Proceedings. Editors: Ephraim Suhir, AT&T Bell Laboratories, New Jersey; Robert C.
Cammarata, The Johns Hopkins University; Deborah D. Chung, State University of New York, Buffalo; Masahiro Jono, Osaka City University, Japan, Osaka City University, Japan.
The need to understand dopant redistribution in refractory metal silicides is important for reliable fabrication of polycide gates and other silicide‐containing structures in VLSI devices. This paper will review work on dopant redistribution in silicides with emphasis on polycide structures.
Of particular concern is the high‐temperature sintering step required to form stable silicide and. Provides coverage of vacuum microelectronics - principles, devices, and applications. This book covers topics that include: Field emission theory; Metal and silicon field emitter arrays; Novel cold cathode materials; and more.
Abstract. Dielectrics are an important class of thin-film electronic materials for microelectronics. Applications include a wide swathe of device applications, including active devices such as transistors and their electrical isolation, as well as passive devices, such as capacitors.
ROBERT B. CALHOUN, DAVID C. DUNAND, in Comprehensive Composite Materials, Dislocations in Thin Film Materials. Dislocations dramatically affect the performance of electronic materials and lead to reliability problems when found in the active region of a device.
The combination of high demand for materials with low defect density and the great versatility of vacuum deposition. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve.
Microelectronics: Edition 2 - Ebook written by Jerry C. Whitaker. Read this book using Google Play Books app on your PC, android, iOS devices. Download for offline reading, highlight, bookmark or take notes while you read Microelectronics: Edition 2. for microelectronic circuits, low-dielectric-constant (low-k) materials are required as the inter- and intra-level dielectric (ILD) insulator of the back-end-of-line inter- connects.
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Frequency Bimonthly Vol/date range Began with 2nd ser., v.
28, no. 2 (Mar./Apr. Related Items Includes: Papers from the International Vacuum Nanoelectronics Conference, ; papers from the.